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Title:
INSULATING SHEET, LAMINATED STRUCTURE, AND MANUFACTURING METHOD OF LAMINATED STRUCTURE
Document Type and Number:
Japanese Patent JP2011124077
Kind Code:
A
Abstract:

To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, capable of obtaining a cured object with high heat resistance and capable of restraining a warp of a laminated object laminated on the cured object.

The insulating sheet contains a polymer with a diphenylene sulfone group, a curing compound with an epoxy group or an oxetane group, a curing agent and a filler. The laminated structure 1 is provided with a substrate 2 having a first conductive layer 2b at least on one of its faces and either a through-hole or a concave part on one of the faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2, and second conductive layers 5, 8 laminated on a face opposite to the face of the substrate 2 laminated with the insulating layers 3, 4 or a circuit board. The insulating layers 3, 4 are formed by curing the insulating sheet.


Inventors:
TAKAHASHI RYOSUKE
MAENAKA HIROSHI
AOYAMA TAKUJI
KUSAKA YASUNARI
INOUE TAKANORI
KONDO SHUNSUKE
YAMADA YU
WATANABE TAKASHI
Application Number:
JP2009280331A
Publication Date:
June 23, 2011
Filing Date:
December 10, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B17/56; C08G59/42; C08G59/62; C08K5/09; C08K9/04; C08L61/00; C08L63/00; C08L81/06; H01B19/00; H01L23/12; H05K1/03; H05K3/46
Attorney, Agent or Firm:
宮▲崎▼ 主税
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