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Patent Searching and Data


Title:
REFRIGERATION/HEAT-INSULATION APPARATUS
Document Type and Number:
Japanese Patent JP2000274908
Kind Code:
A
Abstract:

To provide a refrigeration/heat-insulation apparatus capable of satisfactorily cooling the inside of a chamber while suppressing an increase of energy consumption and enlargement of the apparatus large.

There are provided a casing 10 having a cutout portion 10a, an inner wall of which is formed with a heat pipe panel 14 and which is cut out from outside so as to expose the heat pipe panel 14, a heat absorption surface 21b for absorbing heat through power supply, and a heat dissipation surface 21a for producing heat through power supply, and a cover for sealing the casing 10. In this case, the heat absorption surface 21b is connected with the heat panel 14 from the cutout portion 10a in the casing 10.


Inventors:
RI TAKUGUN
Application Number:
JP1999000084686
Publication Date:
October 06, 2000
Filing Date:
March 26, 1999
Export Citation:
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Assignee:
SEIKO SEIKI KK
International Classes:
F25D11/00; F25B21/02; (IPC1-7): F25D11/00; F25B21/02
Attorney, Agent or Firm:
川井 隆 (外1名)