Title:
断熱下地材、及び断熱下地構造
Document Type and Number:
Japanese Patent JP6782079
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulation backing material and a heat insulation backing structure, capable of forming a thin wall heat insulation layer of high waterproof performance with excellent workability, and used for a backing in an outer covering such as a roof and an outer wall of a building.SOLUTION: In a heat insulation backing material 1 of the present invention, an overlapping receiving part 12 is formed on the upstream side edge in the flow direction, and an overlapping part 13 capable of overlapping with the overlapping receiving part 12 is formed on the downstream side edge, and a drainage ditch 111 is formed in the substantial center in the width direction, and the surface side of the overlapping receiving part 12 is provided with a catchment pit 121 of inclining downward toward the center direction from the lateral side edge, and rainwater collected to the catchment pit 121 can be guided to a heat insulation backing material 1 adjacent to a lower stage by the drainage ditch 111.SELECTED DRAWING: Figure 1
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Inventors:
Hideo Yamada
Application Number:
JP2016040613A
Publication Date:
November 11, 2020
Filing Date:
March 03, 2016
Export Citation:
Assignee:
New Year Beauty Industry Co., Ltd.
International Classes:
E04D12/00; E04B1/64
Domestic Patent References:
| JP9013594A | ||||
| JP8158549A | ||||
| JP2001342695A | ||||
| JP5096251U | ||||
| JP2002250096A | ||||
| JP2006233594A | ||||
| JP2006248542A | ||||
| JP3047082U |
Foreign References:
| US20120055110 |
Attorney, Agent or Firm:
Shinichi Fukuda
Mizusaki Shin
Mizusaki Shin