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Title:
INSULATION CIRCUIT BOARD, ITS MANUFACTURING METHOD AND SEMICONDUCTOR POWER ELEMENT USING THE SAME
Document Type and Number:
Japanese Patent JP2003086747
Kind Code:
A
Abstract:

To provide an insulation circuit board for a semiconductor power element which is superior in usability and has low heat resistance and high reliability.

The insulation circuit board has structure wherein one or more layers of a heat diffusion plate in which a ceramics plate is disposed are arranged between a circuit board and a radiating plate, the heat diffusion plate is made a current flowing path of the semiconductor power element, and, if necessary, a water channel for cooling is formed in the heat diffusion plate.


Inventors:
SUZUKI KIYOMITSU
KURIHARA YASUTOSHI
TAKAHASHI YOSHIMASA
KODAMA HIRONORI
SOFUE MASAHISA
IMAMURA TOSHIYUKI
OSHIMA MASAHIKO
HAMAYOSHI SHIGEYUKI
Application Number:
JP2001273600A
Publication Date:
March 20, 2003
Filing Date:
September 10, 2001
Export Citation:
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Assignee:
HITACHI LTD
HITACHI METALS LTD
International Classes:
H05K7/20; H01L23/373; H01L23/473; H05K1/02; (IPC1-7): H01L23/373; H01L23/473; H05K1/02; H05K7/20
Domestic Patent References:
JPH03261672A1991-11-21
JPH1065292A1998-03-06
JPH05167006A1993-07-02
JP2000183212A2000-06-30
JPH08191120A1996-07-23
JPH11277217A1999-10-12
JP2000150738A2000-05-30
JP2000183260A2000-06-30
JPH0286194U1990-07-09
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)



 
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