To provide an insulation film having a low dielectric constant, high adhesion with a substrate (a member on which the insulating film is formed), high reliability, and high yield during manufacturing.

This insulation film is formed using a composition containing a polymerizable compound having a partial structure including an adamantane type basket structure in a molecule and a polymerizable reactive group contributing to polymerizable reaction and/or polymer where the polymerizable compound is polymerized partially. The linear expansion coefficient of the insulation film in the surface direction is 9×10-6K-1 or higher and 25×10-6K-1 or lower. The polymerizable reactive group of the polymerizable compound contains an aromatic ring, and an ethynyl group or vinyl group directly bonded to the aromatic ring. In the polymerizable compound, preferably, the number of carbons originating in the aromatic ring is 15% or more and 38% or less of the number of carbons in the whole polymerizable compound.