絶縁フィルム構造体及びその製造方法 - Samsung Electro-Mechanics Co., Ltd.

Title:

絶縁フィルム構造体及びその製造方法

Document Type and Number:

Japanese Patent JP5475029

Kind Code:

B2

Abstract:

A method of manufacturing an insulating film structure, including: forming a release layer on one side of a carrier film layer; forming a surface-treated layer formed on the other side of the carrier film layer; and casting an insulating film on the carrier film layer with the release layer formed thereon.

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Inventors:

Kim Seung Hyun
Shin Dong Choi
Lim Sun Tech
Lee Chun Gu
Park Moon Soo

Application Number:

JP2012017990A

Publication Date:

April 16, 2014

Filing Date:

January 31, 2012

Export Citation:

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Assignee:

Samsung Electro-Mechanics Co., Ltd.

International Classes:

H01B17/60; B32B7/02; B32B27/00; B32B27/30; B32B27/32; B32B27/36; B32B27/38; H01B17/56; H01B19/00

Domestic Patent References:

JP2002003702A
JP2009235402A

Attorney, Agent or Firm:

Konobu Kato

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