Title:
INSULATOR ASSEMBLY DEVICE AND INSULATOR ASSEMBLY METHOD
Document Type and Number:
Japanese Patent JP2023082806
Kind Code:
A
Abstract:
To fit a sound absorption heat shielding body to a shape surface of a metal plate, and easily assemble an insulator as much as possible.SOLUTION: An insulator assembly device includes a body part 3, a driver mechanism 40 which is provided in the body part 3, operates a driver by an upper cylinder 42 and drives staples, a feeding mechanism 50 for feeding the staples to the driver mechanism 40, and a clinch mechanism 60 for folding the leg parts of the staples driven by the driver mechanism 40 by a clincher 61, wherein in the state where a sub-unit in which a sound absorption heat shielding body is overlapped on a metal plate is sandwiched between the driver mechanism 40 and the clinch mechanism 60, the metal plate and the sound absorption heat shielding body are stapled by driving the staples by the driver mechanism 40.SELECTED DRAWING: Figure 2
Inventors:
ODAN KAZUNARI
Application Number:
JP2021196749A
Publication Date:
June 15, 2023
Filing Date:
December 03, 2021
Export Citation:
Assignee:
KEYLEX CORP
International Classes:
B23P21/00; B32B7/08; B32B15/08; F02B77/11
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office
Previous Patent: Method for detecting Streptococcus mobilis bacteria
Next Patent: Biofilm formation inhibitor
Next Patent: Biofilm formation inhibitor