Title:
INTEGRAL COMPOSITE MATERIAL OF SILICONE RUBBER AND EPOXY RESIN AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3042358
Kind Code:
B2
Abstract:
PURPOSE: To obtain an integral composite material in which silicone rubber is preferably connected to cured epoxy resin by curing one of organic peroxide curable or addition curable silicone rubber composition and epoxy resin composition, and then curing the other composition in close contact.
CONSTITUTION: Organopolysiloxane having silanol group and aluminum compound are added to bisphenol epoxy resin to obtain epoxy resin composition A. A half amount of the composition A is poured in the cavity 2 of a lower mold 1, heated at 150°C for 3 minutes, and cured. Then, an upper mold 3 is placed on the mold 1 to close the mold 1, organic peroxide curable or addition curable silicone rubber composition A on the composition A is injected from an inlet 4 provided at the top of the mold 3, and heated to be cured at 150°C for 5 minutes. Thus, the epoxy resin is rigidly integrated with the silicone rubber to obtain a composite material.
Inventors:
Noriyuki Kaburaya
Takeo Yoshida
Takeo Yoshida
Application Number:
JP9017395A
Publication Date:
May 15, 2000
Filing Date:
March 23, 1995
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08J5/12; B32B25/08; B32B25/20; C08F290/00; C08F299/08; C08K5/14; C08L63/00; C08L83/07; (IPC1-7): B32B25/20
Domestic Patent References:
| JP337265A | ||||
| JP60238378A | ||||
| JP60177030A |
Attorney, Agent or Firm:
Takashi Kojima