INTEGRAL POLISHING PAD AND ITS MANUFACTURING METHOD

Japanese Patent JP3836825

B2

PROBLEM TO BE SOLVED: To provide a polishing pad which has excellent planarizing efficiency, realizes a stable usage in a polishing process owing to uniformity of physical property of the polishing pad, prevents polishing slurry from being reserved, is easily transported, dispenses with adhesive agent and coupling process for coupling each of constituting elements because they are integrally formed, and realizes simplified manufacturing process.
SOLUTION: This polishing pad comprises: an elastic support layer 110; and a polishing layer 120 formed on the elastic layer and having hardness higher than that of the elastic support layer. The elastic support layer and the polishing layer are formed of a material having chemical compatibility with each other. A structural boundary is not present between the elastic support layer and the polishing layer. A transparent region is provided which is transparent with respect to a light source for detecting surface condition of a subject to be polished, and is integral with a constituting element of another polishing pad 100.

Hyun Fu
Sun-Mock Lee
K-Jung Sung
Sun-Gun Kim
Do-Kwon Sung

JP2003312405A

October 25, 2006

September 04, 2003

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Korea Polio Company Limited

B24B1/00; B24B37/07; B24B37/20; B24B37/22; B24B37/24; B24D3/00; B24D3/32; B24D11/00; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304

JP2002176017A
JP2002170799A
JP2001162515A
JP2001512057A
JP2002144220A
JP2001105299A

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto

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