Title:
集積されたバランおよび変成器構造
Document Type and Number:
Japanese Patent JP2005509300
Kind Code:
A
Abstract:
A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The method then includes laying a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
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Inventors:
You, Chik Patrick
Application Number:
JP2003543189A
Publication Date:
April 07, 2005
Filing Date:
November 05, 2002
Export Citation:
Assignee:
Atheros Communications, Inc.
International Classes:
H01F41/04; H01F19/06; H01L21/822; H01L27/04; H03H7/42; (IPC1-7): H01F41/04; H01F19/06; H01L21/822; H01L27/04; H03H7/42
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto