Title:
INTEGRATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3481353
Kind Code:
B2
Abstract:
PURPOSE: To provide a integrated circuit board for narrowing the width of a transmission line, hence miniaturizing the circuit, flattening the integrated circuit board, and forming a thin-film capacitor and its manufacturing method.
CONSTITUTION: An extremely thin (For example, approximately 30-50μm) thin- layer dielectric substrate 14 consisting of such a dielectric as glass is subjected to anode joint onto the surface of a ground substrate 12 which consists of such a low-resistance material as Si and a metal material with a specific thickness (For example, at least approximately 200μm) which does not cause damages on handling.
Inventors:
Akihiro Masuko
Application Number:
JP15677795A
Publication Date:
December 22, 2003
Filing Date:
May 31, 1995
Export Citation:
Assignee:
Shimada Rika Co., Ltd.
International Classes:
H01L23/15; H01L21/02; H01L21/822; H01L27/04; H01L27/12; (IPC1-7): H01L21/822; H01L23/15; H01L27/04; H01L27/12
Domestic Patent References:
| JP6188438A | ||||
| JP5136383A | ||||
| JP5226660A | ||||
| JP1238066A | ||||
| JP63142851A | ||||
| JP5109823A | ||||
| JP5556016U |
Attorney, Agent or Firm:
Junichi Ueshima
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