PURPOSE: To improve an IC module in rupture strength to external pressure by a method wherein an IC is fixed by bonding to two or more terminals of a lead frame through an insulating adhesive agent.

CONSTITUTION: A lead frame 15 is provided with two or more electrode terminals 11 and a tab 12, where the outermost face of one side 13 and the other side 14 of the electrode terminals 11 is partially gold-plated, and a region of the lead frame 15 where an IC 16 overlaps the electrode terminals 11 and the tab 12 is print-coated with an insulating die bond adhesive agent 17 through a screen printing method. Next, the IC 16 is placed on the insulating die bond adhesive agent 17 and pressed with a specified load, and then the adhesive agent 17 is thermally cured in an oven to make the IC 16 bonded to fix. By this setup, an IC module is improved in rupture strength to external force and an IC card in which the IC module is buried can be improved in reliability.