Title:
INTEGRATED CIRCUIT DEVICE AND RESONANT CIRCUIT
Document Type and Number:
Japanese Patent JPH08330517
Kind Code:
A
Abstract:
PURPOSE: To reduce wiring by decreasing the occupation area of an integrated circuit device using a resonant circuit.
CONSTITUTION: An MIM capacitor 20 consisting of a lower metal layer 21, an insulation layer, and an upper metal layer 62 is arranged at the empty region at the center of a spiral inductor 10 consisting of an upper metal layer 61. The edge part inside the upper metal layer 61 of the inductor 10 is connected to the lower metal layer 21 of the capacitor 20 via a contact hole 41 and the edge part outside the upper metal layer 61 of the inductor 10 is connected to a lower metal layer 22 via a contact hole 42. The upper metal layer 62 of the capacitor 20 is connected to the lower metal layer 20 via a contact hole 43.
Inventors:
NISHIDA MASAO
SAWAI TETSUO
HONDA KEIICHI
UDA NAONORI
HIRAI TOSHIKAZU
HARADA YASOO
SAWAI TETSUO
HONDA KEIICHI
UDA NAONORI
HIRAI TOSHIKAZU
HARADA YASOO
Application Number:
JP13365095A
Publication Date:
December 13, 1996
Filing Date:
May 31, 1995
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
H01F27/00; H01F17/00; H01G4/40; H01L21/822; H01L27/04; H03H5/02; (IPC1-7): H01L27/04; H01F17/00; H01F27/00; H01G4/40; H01L21/822; H03H5/02
Attorney, Agent or Firm:
Fukushima Shoto
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