PURPOSE: To obtain an integrated circuit device which facilitates high speed operation and power consumption saving by a method wherein interconnections between a number of semiconductor integrated circuits formed on a number of respective semiconductor chips formed on one substrate are provided by pads formed on the respective semiconductor chips and wiring films composed of insulating films and wirings which can be connected to the pads and are carried by the insulating films.

CONSTITUTION: A number of semiconductor chips 3 on which semiconductor integrated circuits are formed respectively are formed on one substrate 1 and the semiconductor integrated circuits are interconnected with wirings to form an integrated circuit device. The interconnections between the semiconductor integrated circuits are provided by pads 4 formed on the respective semiconductor chips 3 and wiring films 5 composed of insulating films 6 and wirings 7 which can be connected to the pads 4 and are carried by the insulating films 6. For instance, a group of wirings 7 composed of copper foils or the like are formed on the insulating tape 6 such as a polyimide tape and an insulating tape 8 is further applied to it to form the wiring film 5. Then pads 9 are formed at the intermediate positions of the respective wirings corresponding to the respective pads 4 which can be connected in common and the pads 4 are connected pads 9 with bonding wires 10.