PURPOSE: To uniformalize cross section of the portion mounting IC device to make mechanical strength uniform and to prevent fracture of IC devices by providing a conductor for reinforcement on the face opposite to the portion where the IC device is mounted on wiring substrate.
CONSTITUTION: Insulating substrate 11 is equipped with wiring substrate with wiring conductors 12-14, IC device 15 and sealing resin 18, and provided with conductor for reinforcement 19 at the position corresponding to the IC device mounting portion 15 on the other face of the wiring substrate. The conductor for reinforcement 19 has concurrently been formed with the conductors 12-14, formed on insulating substrate 11 as wiring substrates, on the surface same as terminal pattern 12 for external connection. IC cards using such an IC unit can be prevented from concentration of local stress caused by external forces such as folding and pressing suffered in carriage or employment, and protected against destruction of the IC device 15.
UENISHI KENJI
TAKASE YOSHIHISA
| JPS6451995A | 1989-02-28 |