Title:
金属および粒子で満たされた貫通シリコンビアを含む、集積回路ダイ
Document Type and Number:
Japanese Patent JP5016596
Kind Code:
B2
Abstract:
A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
Inventors:
Alana, Leonel
Newman, Michael
Nateker, Devendra
Newman, Michael
Nateker, Devendra
Application Number:
JP2008517236A
Publication Date:
September 05, 2012
Filing Date:
June 29, 2006
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L25/065; C25D7/12; C25D15/02; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2006111896A | ||||
| JP63121697A | ||||
| JP59031894A | ||||
| JP48081740A | ||||
| JP2005197733A | ||||
| JP11345933A | ||||
| JP2002088482A |
Foreign References:
| US20050121768 |
Attorney, Agent or Firm:
Akihiro Ryuka