PURPOSE: To improve the working efficiency of an integrated circuit device by dividing an external lead cutting mechanism for forming a low melting point glass sealing IC into two stages, and providing a pair of cutting blades for cutting a tie bar piece on the first stage and a pair of cutting blades for cutting integrally the remaining tie bar piece on the second stage.

CONSTITUTION: An external lead cutting nechanism for forming a low melting point glass sealing IC element 1 is divided into first and second stages. With this mechanism, only a tie bar piece 3 of one side of an IC element 1 is cut by upper and lower cutting blades 4, 5 at the first stage, and then the element 1 is cut with upper and lower cutting edges 4', 5' only at the end of the external lead 2 of opposite side as set to the second stage, and are cut in the state that the tie bar pieces 3 is coupled with the tie bar pieces 3' in the longitudinal direction of the package. In this manner, the part which is cut in the chip dropping hole 6 provided under the upper blade 4' is dropped after the cutting, and the element 1 is avoided from feeding onto the conveyor rails 7.