Title:
集積回路製造ツール基板上で温度を検出する装置
Document Type and Number:
Japanese Patent JP4814429
Kind Code:
B2
Abstract:
A cable and interconnect design including a substrate containing discrete sensors in a plurality of cavities or a plurality of thin film sensors deposited throughout the substrate surface. The discrete sensors are bonded within each cavity and potted with a potting compound. Each sensor has leads joined to filaments by an interconnect system. Thin film sensor leads on the substrate connect to a signal transmitting cable by the interconnect system. The filaments are coated and converge at a strain relief coupled to the substrate. The cable, having flat and round portions, includes an array of flat signal transmitting cables arranged side by side in the flat portion and stacked one on top of the other in the round portion. Each signal cable contains a plurality of the filaments bonded together. A pair of ribbons extend along the length of the array of cables. The ribbons and array of cables are bonded together with film to form the flat portion. The ribbons are joined to the strain relief, thereby joining the cable to the substrate. A boot is disposed around the cable transition between the flat and round portions. A connector is coupled to the round portion and the filaments are terminated to the connector. Advantages include the interconnect system bonding pads which reduce fabrication time and provide simple connection geometry on the substrate. Integration of the ribbons into the flat portion allows repeated use in a vacuum seal without damaging the cables. Stacked flat cables make identification of the filaments easy and product assembly fast.
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Inventors:
Lenken Wayne Gee
Sun May H
Sun May H
Application Number:
JP2000617482A
Publication Date:
November 16, 2011
Filing Date:
March 30, 2000
Export Citation:
Assignee:
Sensorray Corporation
International Classes:
G01K1/14; G01K1/02; G01K7/00; H01L21/00; H01L21/02
Domestic Patent References:
| JPH11118616A | 1999-04-30 | |||
| JPH02278216A | 1990-11-14 | |||
| JPH07320544A | 1995-12-08 | |||
| JPH01113914U | 1989-07-31 | |||
| JPH01309281A | 1989-12-13 | |||
| JPH1151776A | 1999-02-26 | |||
| JPH10319241A | 1998-12-04 | |||
| JPH109963A | 1998-01-16 | |||
| JPH06349606A | 1994-12-22 | |||
| JPH03293723A | 1991-12-25 | |||
| JPH09105683A | 1997-04-22 | |||
| JPH09189613A | 1997-07-22 |
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda