Title:
統合された流体ポンプ及びラジエータリザーバ
Document Type and Number:
Japanese Patent JP2009532609
Kind Code:
A
Abstract:
An integrated pumping assembly includes a pump coupled to a heat exchanging device via a mounting plate. The mounting plate is sealed to the heat exchanging device. The heat exchanging device is any fluid-based heat exchanging device, such as a fluid radiator configured to operate as a heat rejector or a heat exchanger configured to remove heat from a heat generating device. The pump is mounted directly to the mounting plate. A mounting mechanism compresses the pump housing and the mounting plate. One or more sealing washers, such as o-rings, are positioned between the pump housing and the mounting plate. The pump, mounting plate, and the heat exchanging device are aligned such that an opening in the pump housing, an opening in the mounting plate, and an opening in the housing of the heat exchanging device are aligned to form a sealed fluid path through which fluid is exchanged between the pump and the heat exchanging device.
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Inventors:
Conway, Bruce, Earl.
Cao, Paul
Lynn, Eric
Butterfly, norman
Cao, Paul
Lynn, Eric
Butterfly, norman
Application Number:
JP2009503087A
Publication Date:
September 10, 2009
Filing Date:
March 30, 2007
Export Citation:
Assignee:
Courigi Inc.
International Classes:
F04D29/58; F04D1/00
Attorney, Agent or Firm:
Akira Koike
Seiji Iga
Seiji Iga