Title:
INTER-LAYER CONNECTION SYSTEM
Document Type and Number:
Japanese Patent JP3191393
Kind Code:
B2
Abstract:
PURPOSE: To mutually connect patterns on different layers by connection paths as rich as possible with respect to the inter-layer connection system of a computer-assisted device which generates a printed wiring pattern consisting of plural layers.
CONSTITUTION: This inter-layer connection system is provided with an overlap area determining means 101 which finds the overlap area A of specified patterns P on plural specified layers, a connection position selecting means 102 which selects the set positions of connection paths V mutually connecting the respective patterns in the found overlap area between the different layers according to a specific reference, a connection position correcting means 103 which calculates the gap between the selected connection path and an existent pattern P2 and determining the set positions of the connection paths excluding connection paths whose gaps are less than the reference, and a connection position correcting means 104 which corrects the existent pattern so that the gap becomes larger than the reference and determines the set positions of the connection paths excluding connection paths which are not corrected successfully.
Inventors:
Akihiko Suehiro
Michio Yamazaki
Michio Yamazaki
Application Number:
JP8583492A
Publication Date:
July 23, 2001
Filing Date:
April 08, 1992
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/12; G06F17/50; H05K3/46; (IPC1-7): G06F17/50; H01L23/12; H05K3/46
Domestic Patent References:
| JP4566A | ||||
| JP1292473A |
Attorney, Agent or Firm:
Junichi Yokoyama
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