Title:
INTERCONNECTING DEVICE HAVING CONTACT BUMP ON SAME PLANE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04313247
Kind Code:
A
Abstract:
PURPOSE: To obtain a method for manufacturing a contact bump for easily obtaining a property of being flush with the contact surface of bump electrodes used for high-density packaging, such as a multi-chip module. CONSTITUTION: Bumps are obtained by an additional formation process for a flat reference surface. First, a bump is formed as an isolated object, being buried in a temporary formation layer made of a stable material in terms of a method on the surface. Namely, the bump is formed separately from a line or a trace and is incorporated into it. After a circut has been formed, a surface that becomes a flat reference and a temporarily stable formation layer are eliminated, and a circuit interconnection device with a bump 116 at a height equal to the contact surface of a flat mesa 18 on the same surface is left.
Inventors:
GUREGARI EICHI NERUSUN
Application Number:
JP27579591A
Publication Date:
November 05, 1992
Filing Date:
October 23, 1991
Export Citation:
Assignee:
ROGERS CORP
International Classes:
H01L21/3065; H01L21/3205; H01L21/60; H01L23/498; H01L21/302; H05K3/40; H05K3/20; H05K3/38; H05K3/46; (IPC1-7): H01L21/302; H01L21/3205; H01L21/321; H01L21/60
Attorney, Agent or Firm:
Yoshio Kawaguchi (3 outside)