To provide a device and a method where efficiency in supply of a fluid to a wafer surface and removal of the fluid therefrom is increased.

A proximity head 106 includes source supply inlets 1302,1306 and a source outlet 1304. An isopropyl alcohol vapor 1310 contained in a nitrogen gas is supplied onto the wafer surface through the inlet 1302, a vacuum 1312 is created on the wafer surface through the outlet 1304, and a treating liquid is supplied onto the wafer surface through the source supply inlet 1306. A fluid mechanics 140 can be generated by creating the vacuum 1312 to remove the liquid 1310 from the wafer surface 108a and by supplying the liquid 1310. The mechanics 140 is a fluid layer formed between the head 106 and the wafer surface, and can be moved across the surface 108a in a stable and controllable condition.