Title:
INTERIOR FINISH BUILDING MATERIAL OF COMPOSITE WOODY CHIP BOARD
Document Type and Number:
Japanese Patent JP2003001613
Kind Code:
A
Abstract:
To provide an interior finish building material which has a wide application by forming one surface in a smooth surface and which has many functions such as a sound absorption, a heat insulation and the like.
A front smooth cement board is molded by casting a raw material mixed in a cement paste-like state of a suitable softness in a predetermined form lightly operating a vibrator, then continuously mixing the mixture, uniformly laying the mixed woody chips in a predetermined thickness, smoothing the chips, pressurizing and vibrating the chips.
Inventors:
OSAKO MITSURU
Application Number:
JP2001234248A
Publication Date:
January 08, 2003
Filing Date:
June 26, 2001
Export Citation:
Assignee:
OSAKO MITSURU
International Classes:
B27N3/02; B32B13/10; E04B1/92; E04F13/08; (IPC1-7): B27N3/02; B32B13/10; E04B1/92; E04F13/08