Title:
MOLDING DIE FOR INTERIOR MATERIAL
Document Type and Number:
Japanese Patent JP2023170391
Kind Code:
A
Abstract:
To provide a molding die capable of suppressing the bonding of an adhesive to the molding die and easily peeling off the bonded adhesive without causing the deterioration of workability.SOLUTION: A molding die 1 for an interior material 2 for crimping a skin material 22 onto a surface of a base material 21 using adhesive 23 includes: a male mold 11 and a female mold 12 that crimp the base material 21 and the skin material 22 in a superimposed state by clamping the molds; and a non-adhesive resin part 13 disposed at a peripheral edge of the male mold 11 and/or the female mold 12 that applies crimping force by clamping to an end of the skin material 22. The resin part 13 is embedded in a recess 11b that is concave with respect to a metal molding surface part 11a that exerts a crimping force on a general surface of the base material 21 or the skin material 22 formed in the male mold 11 and/or the female mold 12 in which the resin part 13 is provided to form a molding surface 13a flush with the molding surface part 11a.SELECTED DRAWING: Figure 7
Inventors:
UMISHIO NAOHISA
Application Number:
JP2022082108A
Publication Date:
December 01, 2023
Filing Date:
May 19, 2022
Export Citation:
Assignee:
MITAKU KOGYO KK
International Classes:
B29C43/36; B29C43/20; B29C43/34
Attorney, Agent or Firm:
Patent Attorney Corporation Okada International Patent Office
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