Title:
INTERLAYER INSULATING FILM, ITS FORMING METHOD, AND POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JP2004067877
Kind Code:
A
Abstract:
To provide an interlayer insulating film which is low in dielectric constant and hygroscopic property and which at the same time is superior in mechanical strengths.
The interlayer insulating film comprises a polymer in which a first monomer which has a substituted acetylenyl group and is polymerizable to three-dimensional directions, e.g. an adamantane derivative having a substituted acetylenyl group, and a second monomer which has a substituted cyclopentanonyl group and is polymerizable to two-dimensional directions, e.g. an aromatic derivative having a substituted cyclopentanonyl group are polymerized three-dimensionally.
Inventors:
AOI NOBUO
Application Number:
JP2002229013A
Publication Date:
March 04, 2004
Filing Date:
August 06, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C08F238/02; C08F232/06; C09D4/00; H01L21/312; H01L21/768; H01L23/522; (IPC1-7): C08F238/02; C08F232/06; H01L21/312; H01L21/768
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Teshima Masaru
Atsushi Fujita
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Teshima Masaru
Atsushi Fujita
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