To provide a positive photosensitive resin composition having high sensitivity, high resolution and a high residual film ratio.

The positive photosensitive resin composition comprises an alkali-soluble resin (A) and a naphthoquinonediazidosulfonic ester compound of phenol (B) having a hydroxyl group concentration of ≤0.0060 mol/g and represented by formula (1), wherein R1is a divalent organic group; R2and R3are each H, halogen, an alkyl group, a substituted alkyl group, a cycloalkyl group, a substituted cycloalkyl group, an aryl group, a substituted aryl group, a 1-5C alkoxy group or a 1-5C acyl group, R2and R3may be the same or different; a and b are each an integer of 0-3, when a plurality of symbols R2are present, they may be the same or different, and when a plurality of symbols R3are present, they may be the same or different.

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