Title:
【発明の名称】補強された直接結合銅構造体
Document Type and Number:
Japanese Patent JP3126977
Kind Code:
B2
Abstract:
A direct (metal-metal compound eutectic) bond process is improved by disposing a eutectic/substrate-wetting enhancement layer on the substrate prior to performing the direct bond process to bond a metal foil to the substrate. Where the metal is copper, the direct bond process is effective on tungsten, molybdenum and aluminum nitride. A variety of new structures may be produced using the process. The eutectic/substrate-wetting enhancement layer is preferably a noble-like metal or includes a noble-like metal such as platinum, palladium and gold.
Inventors:
Harold Frank Webster
Konstantin Alois Neugebauer
James Francis Burges
Konstantin Alois Neugebauer
James Francis Burges
Application Number:
JP32614290A
Publication Date:
January 22, 2001
Filing Date:
November 29, 1990
Export Citation:
Assignee:
General Electric Company
International Classes:
B23K1/19; B32B15/01; C04B37/02; H01B1/02; H05K1/03; H05K3/38; (IPC1-7): C04B37/02; B23K1/19; H01B1/02
Domestic Patent References:
| JP63297287A | ||||
| JP63139072A | ||||
| JP4867131A | ||||
| JP1261283A | ||||
| JP1201085A | ||||
| JP62219546A | ||||
| JP1272183A | ||||
| JP60167358A | ||||
| JP60177634A |
Attorney, Agent or Firm:
Tadao Hirata (1 outside)