Title:
INTERNAL COMBUSTION ENGINE IGNITION DEVICE AND PACKAGE CONTAINING ELECTRONIC PART USED THEREFOR
Document Type and Number:
Japanese Patent JP3886736
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To protect a circuit unit and a power device unit included in a molded- type internal combustion engine ignition package (igniter) against damages, by improving a power semiconductor device in heat radiating properties and by protecting a package against warpages caused, by a linear expansion coefficient difference between a heat sink/molded resin.
SOLUTION: A power semiconductor device 2 used as a switching device for an ignition coil and a heat sink (lead frame) 1-2 used for the power semiconductor device 2 are embedded in batch in a molding resin 4. The top and under surface of the heat sink 1-2 together with the power semiconductor device 2 are covered with the molded resin 4, and at least either the top surface or the undersurface of the heat sink 1-2 is partially exposed.
Inventors:
Toshiaki Kaminaga
Noboru Sugiura
Ryoichi Kobayashi
Noboru Sugiura
Ryoichi Kobayashi
Application Number:
JP2001138747A
Publication Date:
February 28, 2007
Filing Date:
May 09, 2001
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立カーエンジニアリング
株式会社日立カーエンジニアリング
International Classes:
F02P3/055; H01F38/12; F02P15/00; (IPC1-7): H01F38/12; F02P3/055; F02P15/00
Domestic Patent References:
| JP11037029A | ||||
| JP63043416U | ||||
| JP8339927A | ||||
| JP6295830A | ||||
| JP2001015682A | ||||
| JP2000269415A | ||||
| JP2000228322A | ||||
| JP11111544A | ||||
| JP8042438A | ||||
| JP6299939A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
Katsuo Ogawa
Kyosuke Tanaka
Katsuo Ogawa
Kyosuke Tanaka