To provide a microchannel heat exchanger which realizes appropriate temperature uniformity in a heat source, in particular a heat exchanger capable of reducing the pressure drop between inlet and outlet fluid ports.
The microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprises a first set of fingers 118B, 118C for feeding fluid of a first temperature to a heat exchange region. The fluid in the heat exchange region flows toward a second set of fingers 118E, 118F, and exits from the heat exchanger at a second temperature. Each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and is arranged in parallel. A manifold layer 106 includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. The configuration and dimensions of the fingers 118 are determined depending on the hot spots of the heat source which is an electron device 99 which needs to be cooled.
MUNCH MARK
ZHOU PENG
SHOOK JAMES G
UPADHYA GIRISH
GOODSON KENNETH
CORBIN DAVID
| JP2006516068A | 2006-06-15 | |||
| JP2006514734A | 2006-05-11 | |||
| JP2006517728A | 2006-07-27 | |||
| JP2006506603A | 2006-02-23 |
| WO2004042306A2 | 2004-05-21 | |||
| WO2004042313A1 | 2004-05-21 | |||
| WO2004042303A2 | 2004-05-21 | |||
| WO2004042297A2 | 2004-05-21 |
Eiichi Tamura
Seiji Iga