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Patent Searching and Data


Title:
イオンビーム装置
Document Type and Number:
Japanese Patent JP7016867
Kind Code:
B2
Abstract:
An apparatus may include a platen to hold a substrate. A substrate plane structure may be disposed in front of the platen. The substrate plane structure has an opening therein. The apparatus may further include a removable structure disposed in the opening of the substrate plane structure. The removable structure may have an opening exposing a surface of the platen.

Inventors:
Ernest E Allen
Richard Jay Hertel
JR Wallace
Keith A Mirror
Application Number:
JP2019522522A
Publication Date:
February 07, 2022
Filing Date:
October 26, 2017
Export Citation:
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Assignee:
Varian Semiconductor Equipment Associates Incorporated
International Classes:
H01L21/302; H01J37/305; H01L21/683
Domestic Patent References:
JP2011014943A
JP2005135867A
JP4030419A
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Masaaki Ishikawa