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Title:
ION IMPLANTATION APPARATUS
Document Type and Number:
Japanese Patent JPS5855559
Kind Code:
A
Abstract:

PURPOSE: To provide an ion implantation apparatus of which workability of implantation to plural wafers is enhanced, by arranging plural ion beam irradiation parts so as to encircle a cylindrical target having plural wafer support orifices.

CONSTITUTION: Plural wafer support orifices 4 are formed to the wafer support surfaces of a cylindrical target 3 and this target 3 is supported so as to be rotatable and parallely movable. Around this cylindrical target 3, plural ion beam irradiation parts consisting of ion sources 1 and analyzing parts 2 having same performances are arranged so as to provide equal distances from the wafer support surfaces of the cylindrical target 3. By this apparatus, uniform ion implantation can be carried out against the wafers held by plural support orifices 4 in such a condition that the cylindrical target 3 is rotated and moved to left and right or up and down.


Inventors:
KAWAI TEI
OONISHI TOYOICHI
HIRAMATSU TSUNEO
ISHIDA TOSHIAKI
Application Number:
JP15249081A
Publication Date:
April 01, 1983
Filing Date:
September 25, 1981
Export Citation:
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Assignee:
NISSIN HIGH VOLTAGE CO LTD
International Classes:
C23C14/48; H01J37/317; (IPC1-7): C23C11/00
Domestic Patent References:
JPS51111482A1976-10-01
Attorney, Agent or Firm:
Hideki Aoki