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Title:
ION INJECTION APPARATUS
Document Type and Number:
Japanese Patent JP04079142
Kind Code:
A
Abstract:

PURPOSE: To prevent an ion-injected material such as a wafer, from being charged up caused by scondary electrons by installing a conductive lattice to cover a target plate on the surface of the target opposite to a filament of the target plate.

CONSTITUTION: A wire net 13 is fixed in a target plate 15 by an insulator 12. The wire net 13 is made wide enough to cover the target plate 15. Since having high energy, primary electrons 2 radiated from a filament 4 pass the meshes of the wire net and collide against the target plate 15. As a result, secondary electrons 3 are radiated from the target plate 15, but since the secondary electrons 3 have lower energy than the primary electrons 2, the secondary electrons 3 are easy to be affected by negative potential of the wire net 13 and their energy decreases. Consequently, the possibility to capture the secondary electrons 3 by ion beam 1 is heightened, so that negative charging-up of a wafer 11 on a disk 10 owing to the secondary electrons 3 themselves which are not captured by ion beam 1 is avoided.


Inventors:
Ishihara, Yoshitake
Application Number:
JP1990000194538
Publication Date:
March 12, 1992
Filing Date:
July 23, 1990
Export Citation:
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Assignee:
NEC CORP
International Classes:
C23C14/48; H01J37/317; H01L21/265; C23C14/48; H01J37/317; H01L21/02; (IPC1-7): C23C14/48; H01J37/317; H01L21/265



 
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