To provide an iron member for soldering and a soldering apparatus with which a soldering position easily dissipating heat can reliably be soldered, the solder can stably be supplied to the soldering position in a soldering objective article and long service life of the iron member can be obtained.

In the iron member 32 for soldering which is provided with the iron tip part 31 having the soldering surfaces 311A, 311B to which the solder is supplied, a heat-holding part 312 which is formed larger than the tip end part having the soldering surfaces is arranged at the iron member body side seen from the soldering surfaces 311A, 311B of the iron tip part 31, and the difference of levels 313A, 313B is formed at the boundary between the tip end parts having the soldering surfaces 311A, 311B of the iron tip part 31 and the heat-holding part 312.