Title:
FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JP3038287
Kind Code:
B2
Abstract:
PURPOSE: To provide a film forming device which can control the film thickness and adjust the composition by simultaneously sputtering a plurality of targets, provide uniform erosion of the targets, and sufficiently supplement nitrogen or oxygen.
CONSTITUTION: In a film forming device where a substrate and a plurality of targets 24 are arranged opposite to each other in a vacuum chamber 21, and the targets are sputtered by the ion during the plasma discharge to manufacture the film, a substrate rotating mechanism where the substrate 25 is loaded, an active gas feeding mechanism 28 to feed the active nitrogen or the active oxygen into the vacuum chamber 21, and the targets 24 are mouned on a cathode 23, and a helical coil 33 is arranged so that the center axis may be perpendicular to the surface of the targets. A high vacuum and high speed plasma sputter source 22 where a high frequency oscillating source 34 is connected to the helical coil 33 is provided. This constitution forms the film on the surface of the substrate in the high vacuum.
Inventors:
Hiroyuki Fukasawa
Kenichi Takagi
Toshio Negishi
Kenichi Takagi
Toshio Negishi
Application Number:
JP34527893A
Publication Date:
May 08, 2000
Filing Date:
December 20, 1993
Export Citation:
Assignee:
Nippon Vacuum Technology Co., Ltd.
International Classes:
C23C14/34; H01L21/203; H01L21/285; H01L21/31; (IPC1-7): C23C14/34; H01L21/203; H01L21/285; H01L21/31
Domestic Patent References:
| JP61278062A | ||||
| JP61190070A | ||||
| JP3223458A | ||||
| JP61266575A |
Attorney, Agent or Firm:
Shigeru Yagita (3 outside)