To provide a jet nozzle for point soldering with which molten solder is not scattered on the surrounding components and oxidation of the surface of the molten solder can be prevented and, thereby, quality and reliability when soldering is improved.
In the jet nozzle 3 which is installed at the upper position of a solder tank and with which the molter solder is sucked from the underside and jetted upward and which is enclosed with circumferential plates 33 and the bottom plates 35 and the upper part of which is opened, solder recovering holes H is provided to the bottom plates 35, the circumferential plates 33 extended (33A) downward, the plate 33 is bent (33B) to the side of the bottom plates 35 and a gap is formed between the bent tips of the plate 33 and the bottom plates, and the solder recovering grooves S are formed. The molten solder which is fallen through solder recovering holes H is recovered downward through the recovering grooves S and circulated.
Hironori Honda
Toshimitsu Ichikawa
Next Patent: ROLLING APPARATUS