Title:
JET TYPE SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP3745887
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To miniaturize a solder bath, to improve workability in maintenance, etc., and to make a jet pressure over a whole width of a nozzle uniform in the jet type soldering device.
SOLUTION: A once-through type pump 33 is arranged in a solder bath 33 housing a molten solder 30, the molten solder forcibly fed upward by the once-through type pump 33 is jetted for a work from a nozzle 44. An induction motor 61 driving the once-through type pump 33 is provided with a disk shape stator 62 arranged outside the solder bath 31 and a disk shape rotor 63 fixed to a rotation shaft 52 of the once-through type pump 33 inside the solder bath 31 corresponding to the stator 62. The stator 62 is provided with a primary iron core 64 tightly adhered to an outer face of the solder bath 31, a coil 66 wound around the primary iron core 64 and a secondary iron core 67 arranged on an opposite side to the primary iron core 64 while interposing the rotor 63 in-between.
Inventors:
Niki Masuda
Junichi Onozaki
Koji Saito
Junichi Onozaki
Koji Saito
Application Number:
JP26363797A
Publication Date:
February 15, 2006
Filing Date:
September 29, 1997
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K1/08; F04D7/06; H02K7/14; H02K17/02; H05K3/34; (IPC1-7): B23K1/08; F04D7/06; H02K7/14; H02K17/02; H05K3/34
Domestic Patent References:
| JP6000562U | ||||
| JP63006163U | ||||
| JP6190549A | ||||
| JP61012563U |
Attorney, Agent or Firm:
樺澤 襄
Shimamune Masami
Satoshi Kabazawa
Shimamune Masami
Satoshi Kabazawa