To provide a jig for aligning a semiconductor wafer with an external circumferential ring in order to prevent excessive etching on the external circumference of the wafer and carry out uniform etching, and to provide a method of plasma etching using it.
The plasma etching method of semiconductor wafer comprises a step C for center alignment between a base plate and an external circumferential ring by inserting a guide pin for base plate into a center hole of the base plate, a step D for center alignment between the base plate and an aligning plate by inserting the guide pin for aligning plate into the center hole of the alignment plate through the center hole of the base plate, a step E for measuring deviation of the alignment plate in the X and Y directions, and a step G for transferring the wafer to an X-Y stage with a robot hand by compensating for a location of the X-Y stage or an arrangement location of the wafer W with the robot hand on the basis of the measured deviation.
COPYRIGHT: (C)2007,JPO&INPIT
TERASAKI NORIYUKI
ICHIKAWA HIROYUKI
SPEEDFAM CO LTD
| JP2003297894A | 2003-10-17 | |||
| JP2004349587A | 2004-12-09 | |||
| JP2001358097A | 2001-12-26 |