Title:
JIG CHUCK, GRINDING DEVICE, AND METHOD FOR DIVIDING PLATE-LIKE WORKPIECE
Document Type and Number:
Japanese Patent JP2023000305
Kind Code:
A
Abstract:
To implement a DBG process without using a tape.SOLUTION: A plate-like workpiece 20 in which lattice-like grooves 29 are formed on its surface 21 is held by suction using a suction surface 110 of a first jig chuck 100 having suction holes 111. Further, in this state, a rear surface 22 of the plate-like workpiece 20 is ground with a grindstone 77 so that the plate-like workpiece 20 is divided into a plurality of chips 27. At this point, the suction holes 111 of the first jig chuck 100 are respectively arranged below the chips 27 in correspondence with the respective chips 27 of the plate-like workpiece 20. Therefore, the chips 27 remain held on the suction surface 110 by being suctioned by the corresponding suction holes 111, even when the plate-like workpiece 20 is divided into the plurality of chips 27. Accordingly, the chips 27 obtained through the division can be prevented from being scattered without attaching a tape on the surface 21 of the plate-like workpiece 20.SELECTED DRAWING: Figure 12
Inventors:
ABE HIROKI
Application Number:
JP2021101047A
Publication Date:
January 04, 2023
Filing Date:
June 17, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B24B7/04; B24B19/02; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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