Title:
JIG FOR SEMICONDUCTOR THIN-FILM WAFER
Document Type and Number:
Japanese Patent JP2005223046
Kind Code:
A
Abstract:
To provide a jig for a semiconductor thin-film wafer capable of handling, without damaging the semiconductor thin-film wafer.
In the jig 1 for the semiconductor thin-film wafer, own underside has an electrostatic attracting section 2 as a holding surface 22 holding the top face 101 of the semiconductor thin-film wafer 100, by electrostatic attraction against the action of the gravity on the wafer. In the jig 1, own underside further has a handling section 3, in which one end side is connected to the electrostatic attraction section 2, and the other end side is extended in a direction of separating from the electrostatic attracting section 2.
Inventors:
HAGIMOTO KAZUNORI
Application Number:
JP2004027792A
Publication Date:
August 18, 2005
Filing Date:
February 04, 2004
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
B23Q3/15; B25B11/00; B65G49/07; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B23Q3/15; B25B11/00; B65G49/07
Attorney, Agent or Firm:
Masanori Sugawara