Title:
接合体、及び、絶縁回路基板
Document Type and Number:
Japanese Patent JP7124633
Kind Code:
B2
Abstract:
A bonded body is formed by bonding a ceramic member formed of an Al-based ceramic and a copper member formed of copper or a copper alloy, in which, in a bonding layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on a ceramic member side, and, the Al concentration is 0.15 at % or less in a thickness range of 0.5 μm to 3 μm from an interface of the active metal compound layer on a copper member side toward the copper member.
Inventors:
寺▲崎▼ 伸幸
Application Number:
JP2018199139A
Publication Date:
August 24, 2022
Filing Date:
October 23, 2018
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C04B37/02; B23K20/10; H01L23/36
Domestic Patent References:
| JP201658706A | ||||
| JP2015224151A | ||||
| JP5871081B2 | ||||
| JP632669A | ||||
| JP200016878A | ||||
| JP2010215465A | ||||
| JP2004311650A |
Foreign References:
| WO2015122446A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami