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Patent Searching and Data


Title:
JOINED BODY OF INSULATOR AND CONDUCTOR AND JOINING METHOD
Document Type and Number:
Japanese Patent JPH06271361
Kind Code:
A
Abstract:

PURPOSE: To obtain a joined body of an insulator free of mobile ion and a conductor without using an adhesive by anodically joining the insulator and conductor through a conductive film and an insulator layer contg. mobile ion.

CONSTITUTION: A joined body is shown in the figure. An insulator 1 free of mobile ion such as PZT and barium titanate and a conductor 10 such as an Si substrate are joined through a conductive film 3 such as a thin aluminum film and an insulator layer 5 such as glass contg. mobile ion. In this case, the thickness of the insulator layer 5 is controlled to ≤0.5mm, the roughness of the joining surface of the insulator 1 is adjusted to ≤500, and spatial part formed by the recess of the joining surface is controlled to ≤30% of the joining surface. The conductive film 3 is formed on the adhesive surface of the substrate 1, the insulator layer 5 is anodically joined to the conductor 5 with photoirradiation, and finally the conductive film 3 and the insulator layer 5 are anodically joined with photoirradiation to produce the joined body.


Inventors:
AKAIKE MASATAKE
TAMURA MIKI
FUSHIMI MASAHIRO
YAGI TAKAYUKI
Application Number:
JP6429493A
Publication Date:
September 27, 1994
Filing Date:
March 23, 1993
Export Citation:
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Assignee:
CANON KK
International Classes:
B23K28/00; B81B1/00; B81C3/00; C04B37/02; C04B41/87; G01L9/00; H01B5/14; (IPC1-7): C04B37/02; B23K28/00; C04B41/87; H01B5/14
Attorney, Agent or Firm:
Wakabayashi Tadashi