Title:
JOINING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2010051988
Kind Code:
A
Abstract:
To provide a joining apparatus and method for joining without damaging members to be joined with a laser beam when soldering is performed using a laser beam.
A first member 102 is irradiated with a laser beam of a low energy level by which solder 103 is unfused, by using a laser irradiation device 150. On the basis of measurement results of temperature measuring instruments 120A, 120B, a normal/defective condition is discriminated on the abutting state of the first and second members 102, 100. If the abutment is discriminated as satisfactory, the first member 102 is irradiated with a laser beam of a high energy level by which the solder 103 is fused, thereby joining the first and second members 102, 100.
Inventors:
MORII KOJIRO
TANIGUCHI KIMIHIRO
YAMAWAKI CHIAKI
TAMOTO HIROKI
TANIGUCHI KIMIHIRO
YAMAWAKI CHIAKI
TAMOTO HIROKI
Application Number:
JP2008217776A
Publication Date:
March 11, 2010
Filing Date:
August 27, 2008
Export Citation:
Assignee:
SHARP KK
International Classes:
B23K1/005; B23K1/00; B23K101/36
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
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