Title:
接合装置、接合方法および接合体
Document Type and Number:
Japanese Patent JP6865093
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a joining device that enables reliable joining without forming a portion projecting outside from the surface of a joined body in which a plurality of members are joined, and to provide a joining method and a joined body.SOLUTION: A joining device 10 is a joining device for a layered members, in which a plurality of members 13 are layered between a die 11 and a punch 12 arranged opposite to each other, and the plurality of members 13 are pressed and joined such that the die 11 and the punch 12 move close to each other. The die 11 is configured to have a substantially flat or projecting shape. They are joined by forming a fitting structure EG for a recess and projection in the thickness direction of the plurality of members 13 pressed, without projecting the plurality of members 13 to be pressed, beyond the total thickness of these members.SELECTED DRAWING: Figure 1
Inventors:
Takenobu Hongo
Application Number:
JP2017084426A
Publication Date:
April 28, 2021
Filing Date:
April 21, 2017
Export Citation:
Assignee:
Astor Co., Ltd.
International Classes:
B21D39/03; B21D47/04
Foreign References:
| DE10130726A1 | ||||
| DE102009023717A1 | ||||
| US5208973 | ||||
| US20050229378 |
Attorney, Agent or Firm:
Masashi Sahara
Kazuki Yokota
Kazuki Yokota