Title:
接合材およびそれを用いた接合方法
Document Type and Number:
Japanese Patent JP6662619
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a joint material capable of preventing crack or detachment of predried film and favorably jointing articles to be jointed each other even via a projection part of the predried film and a joint method using the same.SOLUTION: In a joint material consisting of a silver paste by mixing a silver fine particle having average primary particle diameter of 40 to 130 nm and coated by an organic compound having 8 or less carbon atoms such as sorbic acid and a solvent, diol such as octane diol is used as the solvent, triol having the boiling point of 200 to 300°C and viscosity at 20°C of 2,000 to 10,000 mPa such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol is mixed as an additive and dicarboxylic acid such as oxy diacetic acid is mixed as a sintering accelerator.SELECTED DRAWING: None
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Inventors:
Kurita Satoshi
Keiichi Endo
Hiromasa Miyoshi
Keiichi Endo
Hiromasa Miyoshi
Application Number:
JP2015232895A
Publication Date:
March 11, 2020
Filing Date:
November 30, 2015
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F7/08; B22F1/00; B22F1/02; B23K20/00; H01L21/52; H05K3/32
Foreign References:
| WO2009116185A1 | ||||
| WO2012169076A1 |
Attorney, Agent or Firm:
Koichi Okawa