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Patent Searching and Data


Title:
JOINING METHOD OF FINE WIRE
Document Type and Number:
Japanese Patent JPS60210383
Kind Code:
A
Abstract:

PURPOSE: To bond surely and securely a fine wire by pressing and fitting the fine wire into the fine-wire fitting part provided to a material to be joined and irradiating an energy beam like a spot to both members.

CONSTITUTION: A square groove 2 is provided to a terminal 1 and the fine wire 3 is pressed and fitted into the groove 2 by means of a press-fitting jig, etc. The wire 3 is so positioned that the end thereof do not jump out of the groove 2. The laser beam B is irradiated like a spot to both members in this state. The spot center of the beam B is made coincident with the center of the wire 3 to prevent the molten state from deviating from the axis of the wire 3. The beam B joins instantaneously the wire 3 and the terminal 1 and therefore the joining in the atm. is made possible. Since the end of the terminal 1 and the boundary between the molten part and unmolten part is spaced by ≥0.5 times the diameter of the wire 3, the wire 3 is surely and securely joined and the automatic joining operation is made possible.


Inventors:
KUMAZAWA TETSUO
TOMOSAKI RIYOUZOU
Application Number:
JP6332284A
Publication Date:
October 22, 1985
Filing Date:
April 02, 1984
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23K26/21; B21F15/00; B21F15/10; B23K15/00; (IPC1-7): B21F15/10; B23K15/00
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)