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Patent Searching and Data


Title:
JOINING METHOD
Document Type and Number:
Japanese Patent JPH101773
Kind Code:
A
Abstract:

To provide a fresh joining method capable of three-dimensionally and universally joining microparts of mm order or below.

This joining method joins the parts desired to be joined for example, the parts to be joined to each other of a shape memory member 1 of an active curving mechanism to be applied to a catheter and a connecting unit 2 by depositing a metal from the vapor of an org. metal compd. by using a CVD method on these parts and joining these parts by the metal and is particularly useful for the microassemblies. At least the parts desired to be joined are preferably cooled by using a Peltier element 4, etc. A photo CVD method using a continuous UV laser beam is more preferable among the CVD methods. Since the joining material is the metal, the joint structure having heat resistance is obtd.


Inventors:
ESASHI MASAKI
MINAMI KAZUYUKI
SUGIHARA MASAHISA
Application Number:
JP15131796A
Publication Date:
January 06, 1998
Filing Date:
June 12, 1996
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD
ESASHI MASAKI
International Classes:
B23K28/00; B81B7/02; B81C3/00; C23C16/18; (IPC1-7): C23C16/18; B23K28/00
Attorney, Agent or Firm:
Takashima Hajime