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Title:
Joining method
Document Type and Number:
Japanese Patent JP5986929
Kind Code:
B2
Abstract:
There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.

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Inventors:
Kurita Satoshi
Keiichi Endo
Yu Saito
Hisaeda Minoru
Toshihiko Ueyama
Application Number:
JP2012545628A
Publication Date:
September 06, 2016
Filing Date:
May 13, 2011
Export Citation:
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Assignee:
dowa Electronics Co., Ltd.
International Classes:
B23K20/00; B22F1/052; B22F1/102; B22F7/02; B23K20/16; H01B1/00; H01B1/22; H01L21/52; B22F1/148
Domestic Patent References:
JP4928639B22012-05-09
JP2009104807A2009-05-14
JP2007227493A2007-09-06
JP2004082667A2004-03-18
JP2002001520A2002-01-08
JP2002334618A2002-11-22
JP2002126869A2002-05-08
JP2001085828A2001-03-30
JPH10242356A1998-09-11
JPH08164494A1996-06-25
JP5651113B22015-01-07
JP2010207863A2010-09-24
JP2000197990A2000-07-18
JP2010153118A2010-07-08
JP2010053377A2010-03-11
JP2010077266A2010-04-08
JP2001329233A2001-11-27
JP2002334618A2002-11-22
JP5651113B22015-01-07
JP4928639B22012-05-09
JP2009104807A2009-05-14
JP2007227493A2007-09-06
JP2004107728A2004-04-08
JP2004082667A2004-03-18
JP3385272B22003-03-10
JP2002126869A2002-05-08
JP2002001520A2002-01-08
JP2001150183A2001-06-05
JP2001105180A2001-04-17
JP2001085828A2001-03-30
JPH10242356A1998-09-11
JPH08164494A1996-06-25
Foreign References:
WO2009157309A12009-12-30
WO2009157309A12009-12-30
Attorney, Agent or Firm:
Aniya Setsuo
Hitoshi Kiyono
Okuyama Tomohiro
Hashimura Kazumasa



 
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