Title:
JOINING STRUCTURE AND ITS MANUFACTURING METHOD, AND COOLER
Document Type and Number:
Japanese Patent JP2016052666
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a joining structure which suppresses a malfunction caused by the generation and growth of spatters or burrs which are generated at joining without complicating or enlarging a device for joining joined members, and a cooler including the joining structure.SOLUTION: A joining structure comprises a first joined member 1 having a first main surface 1s, and a second joined member 2 having a second main surface 2s. The first joined member 1 and the second joined member 2 are connected to each other in a joining part 3. At least either of the first or second joined members 1, 2 includes a thin-thick part 5 in the joining part 3. A thickness with respect to a direction which intersects with the main surfaces 1s, 2s in the thin-thickness part 5 is thinner than a thickness of a heavy-thickness part other than the thin-thickness part 5.SELECTED DRAWING: Figure 4
Inventors:
IKEDA TAKUYA
MONOTANE TAKESHI
ISHII RYUICHI
TOCHIYAMA SHIGENOBU
MONOTANE TAKESHI
ISHII RYUICHI
TOCHIYAMA SHIGENOBU
Application Number:
JP2014178899A
Publication Date:
April 14, 2016
Filing Date:
September 03, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K20/12; B23K1/00; B23K9/00; B23K11/00; B23K11/36; B23K15/00; B23K26/21
Attorney, Agent or Firm:
Fukami patent office