Title:
Joining structure and a joining method for the same of metal parts
Document Type and Number:
Japanese Patent JP6156625
Kind Code:
B2
Abstract:
A flange 24 is provided around a metal cap 21. A wire 25 is disposed on a bottom surface of the flange 24 while formed into a circular shape. Preferably the wire 25 is tack-welded to the bottom surface of the flange 24. The wire 25 to be used has a melting point within a range of -150°C to +150°C with respect to melting points of the metal cap 21 and a metal base 22. The flange 24 of the metal cap 21 and the metal base 22 overlap each other with the wire 25 sandwiched therebetween. Then a current is passed between the flange 24 of the metal cap 21 and the metal base 22 to melt the wire 25, whereby the flange 24 and the metal base 22 are resistance-welded to each other.
Inventors:
Hideoka Yoshioka
Shogo Nagasaka
Makoto Tsuchida
Hitoshi Yoshida
Shogo Nagasaka
Makoto Tsuchida
Hitoshi Yoshida
Application Number:
JP2013051049A
Publication Date:
July 05, 2017
Filing Date:
March 13, 2013
Export Citation:
Assignee:
OMRON Corporation
International Classes:
B23K11/00; B23K11/14; H01H11/00
Domestic Patent References:
| JP6063759A | ||||
| JP2002075108A | ||||
| JP11077316A | ||||
| JP9099376A | ||||
| JP7227680A |
Foreign References:
| US20090294411 |
Attorney, Agent or Firm:
Masafusa Nakano
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