Title:
接合構造体および接合方法
Document Type and Number:
Japanese Patent JP7022890
Kind Code:
B2
Abstract:
A highly reliable joined structure and joining method by suppressing peeling at joined portions in the joined structure formed by joining metals together is provided. A joined structure includes a plurality of metals laminated and joined together. The plurality of metals are shaped to include a plurality of convex portions arranged on a surface positioned in a lamination direction, and flat portions arranged between the plural convex portions. Tip ends of the plurality of convex portions are formed as curved surfaces.
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Inventors:
Takayuki Hirose
Yasushi Taniguchi
Seiji Kumazawa
Takayuki Ashida
Yasushi Taniguchi
Seiji Kumazawa
Takayuki Ashida
Application Number:
JP2018009863A
Publication Date:
February 21, 2022
Filing Date:
January 24, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B23K20/10; B32B3/02; B32B15/01; H01M4/02; H01M4/13
Domestic Patent References:
| JP2014143230A | ||||
| JP2016052670A | ||||
| JP2003508270A | ||||
| JP2009516594A |
Attorney, Agent or Firm:
Kenji Kamata
Koichi Nomura
Koichi Nomura